Hakko 485
High Performance Soldering System
The Hakko 485 is a compact, high performance
soldering system developed exclusively for soldering and de-soldering
components and connectors mounted on PC boards.
Click to enlarge
Solder flow is time controlled and temperature controlled.
Soldering and de-soldering cycles are automatic and precise.
A built-in locator light pinpoints the exact position for placing
components.
Solder remaining in through holes is completely removed by using
the air unit.
A large selection of nozzle sizes is available.
Part Number
485-V12
Power Consumption
850W
Room Temperature
Between -5°C (23°F) and 40°C
(104°F)
Temperature Control
Normal temperature - 299°C
(570°F)
Solder
10 kg (22 lb.)
Heating Element
800W (400W x 2)
Air Pressure
2 kg/cm² (4.4 lbs.) - 10 kg/cm²
(22 lbs.)
Dimensions
485 (Body)
500(W) x 245(H) x 550(D) mm 19.7(W) x
9.6(H) x 21.7(D) in.
485 (Air Unit)
150(W) x 100(H) x 300 (D) mm 5.9(W) x
3.9(H) x 11.8(D) in.
Weight
485 (Body)
35 kg. (77 lbs.) without solder
485 (Air Unit)
3.5 kg. (7.7 lbs.)